[Nanoshel] Copper Sputtering Target

Cu, Purity: 99.99%, Dia: 50±1mm

CAS : 7440-50-8
Purity : 99.99%
Diameter : 50 mm ± 1mm
Thickness : 3 mm ± 0.5mm
Molecular Weight : 63.547 g/mol
Density : 8.96 g/cm³
Melting Point : 1084.62 °C
Shape : Round
Backing Plate : Copper (as per customer requirement)
Size and Shape : Targets Diameter and thickness can be according to Customer Requirement
Conclusion : The specifications Confirm with enterprise standard